Archive for January, 2022

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Multi-Chip Modules are Making a Difference

Helping customers sustain old products and innovate forward with new products. Last year we saw emerging flexibility in requirements for RF/microwave control products used by several aerospace and defense customers. Systems that used to require chip and wire in hermetic packages could be transitioned to use plastic encapsulated modules with SMT components on substrate if the new designs met their performance needs. Two of our engineering services engagements illustrate this trend. In one case, a customer needed to replace multiple obsolete switch drivers ... Read more